| Age | Commit message (Collapse) | Author |
|---|
|
Since commit 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal
zone parameters structure"), thermal_zone_device_register() allocates
a copy of the tzp argument and frees it when unregistering, so
thermal_of_zone_register() now ends up leaking its original tzp and
double-freeing the tzp copy. Fix this by locating tzp on stack instead.
Fixes: 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal zone parameters structure")
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: 6.4+ <stable@vger.kernel.org> # 6.4+: 8bcbb18c61d6: thermal: core: constify params in thermal_zone_device_register
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Since commit 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal zone
parameters structure"), thermal_zone_device_register() allocates a copy
of the tzp argument and callers need not explicitly manage its lifetime.
This means the function no longer cares about the parameter being
mutable, so constify it.
No functional change.
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These extend the int340x thermal driver, add thermal DT bindings for
some Qcom platforms, add DT bindings and support for Armada AP807 and
MSM8909, allow selecting the bang-bang thermal governor as the default
one, address issues in several thermal drivers for ARM platforms and
clean up code.
Specifics:
- Add new IOCTLs to the int340x thermal driver to allow user space to
retrieve the Passive v2 thermal table (Srinivas Pandruvada)
- Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms
(Konrad Dybcio)
- Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki)
- Add DT bindings for QCom ipq9574 (Praveenkumar I)
- Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren)
- Allow selecting the bang-bang governor as default (Thierry Reding)
- Refactor and prepare the code to set the scene for RCar Gen4
(Wolfram Sang)
- Clean up and fix the QCom tsens drivers. Add DT bindings and
calibration for the MSM8909 platform (Stephan Gerhold)
- Revert a patch introducing a wrong usage of devm_of_iomap() on the
Mediatek platform (Ricardo Cañuelo)
- Fix the clock vs reset ordering in order to conform to the
documentation on the sun8i (Christophe JAILLET)
- Prevent setting up undocumented registers, enable the only
described sensors and add the version 2.1 on the Qoriq sensor (Peng
Fan)
- Add DT bindings and support for the Armada AP807 (Alex Leibovich)
- Update the mlx5 driver with the recent thermal changes (Daniel
Lezcano)
- Convert to platform remove callback returning void on STM32 (Uwe
Kleine-König)
- Add an error information printing for devm_thermal_add_hwmon_sysfs()
and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra,
Qoriq, Mediateka and QCom (Yangtao Li)
- Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai)
- Use the dev_err_probe() function in the QCom tsens alarm driver
(Luca Weiss)"
* tag 'thermal-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/drivers/qcom/temp-alarm: Use dev_err_probe
thermal/drivers/generic-adc: Register thermal zones as hwmon sensors
thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start()
thermal/drivers/qcom: Remove redundant msg at probe time
thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor()
thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone()
thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel()
drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe()
thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe()
thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe()
thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register()
thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs()
thermal/drivers/stm32: Convert to platform remove callback returning void
net/mlx5: Update the driver with the recent thermal changes
thermal/drivers/armada: Add support for AP807 thermal data
dt-bindings: armada-thermal: Add armada-ap807-thermal compatible
thermal/drivers/qoriq: Support version 2.1
thermal/drivers/qoriq: Only enable supported sensors
thermal/drivers/qoriq: No need to program site adjustment register
thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensors
...
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull power management updates from Rafael Wysocki:
"These add Intel TPMI (Topology Aware Register and PM Capsule
Interface) support to the power capping subsystem, extend the
intel_idle driver to work in VM guests where MWAIT is not available,
extend the system-wide power management diagnostics, fix bugs and
clean up code.
Specifics:
- Introduce power capping core support for Intel TPMI (Topology Aware
Register and PM Capsule Interface) and a TPMI interface driver for
Intel RAPL (Zhang Rui, Dan Carpenter)
- Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping
driver (Zhang Rui)
- Fix invalid initialization for pl4_supported field in the Intel
RAPL power capping driver (Sumeet Pawnikar)
- Clean up the intel_idle driver, make it work with VM guests that
cannot use the MWAIT instruction and address the case in which the
host may enter a deep idle state when the guest is idle (Arjan van
de Ven)
- Prevent cpufreq drivers that provide the ->adjust_perf() callback
without a ->fast_switch() one which is used as a fallback from the
former in some cases (Wyes Karny)
- Fix some issues related to the AMD P-state cpufreq driver (Mario
Limonciello, Wyes Karny)
- Fix the energy_performance_preference attribute handling in the
intel_pstate driver in passive mode (Tero Kristo)
- Fix the handling of pm_suspend_target_state when CONFIG_PM is unset
(Kai-Heng Feng)
- Correct spelling mistake in a comment in the hibernation code (Wang
Honghui)
- Add arch_resume_nosmt() prototype to avoid a "missing prototypes"
build warning (Arnd Bergmann)
- Restrict pm_pr_dbg() to system-wide power transitions and use it in
a few additional places (Mario Limonciello)
- Drop verification of in-params from genpd_add_device() and ensure
that all of its callers will do it (Ulf Hansson)
- Prevent possible integer overflows from occurring in
genpd_parse_state() (Nikita Zhandarovich)
- Reorder fieldls in 'struct devfreq_dev_status' to reduce its size
somewhat (Christophe JAILLET)
- Ensure that the Exynos PPMU driver is already loaded before the
Exynos Bus driver starts probing so as to avoid a possible freeze
loading of the kernel modules (Marek Szyprowski)
- Fix variable deferencing before NULL check in the mtk-cci devfreq
driver (Sukrut Bellary)"
* tag 'pm-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (42 commits)
intel_idle: Add a "Long HLT" C1 state for the VM guest mode
cpufreq: intel_pstate: Fix energy_performance_preference for passive
cpufreq: amd-pstate: Add a kernel config option to set default mode
cpufreq: amd-pstate: Set a fallback policy based on preferred_profile
ACPI: CPPC: Add definition for undefined FADT preferred PM profile value
cpufreq: amd-pstate: Set default governor to schedutil
PM: domains: Move the verification of in-params from genpd_add_device()
cpufreq: amd-pstate: Make amd-pstate EPP driver name hyphenated
cpufreq: amd-pstate: Write CPPC enable bit per-socket
intel_idle: Add support for using intel_idle in a VM guest using just hlt
cpufreq: Fail driver register if it has adjust_perf without fast_switch
intel_idle: clean up the (new) state_update_enter_method function
intel_idle: refactor state->enter manipulation into its own function
platform/x86/amd: pmc: Use pm_pr_dbg() for suspend related messages
pinctrl: amd: Use pm_pr_dbg to show debugging messages
ACPI: x86: Add pm_debug_messages for LPS0 _DSM state tracking
include/linux/suspend.h: Only show pm_pr_dbg messages at suspend/resume
powercap: RAPL: Fix a NULL vs IS_ERR() bug
powercap: RAPL: Fix CONFIG_IOSF_MBI dependency
powercap: RAPL: fix invalid initialization for pl4_supported field
...
|
|
ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal
Pull thermal control updates for 6.5-rc1 from Daniel Lezcano:
"- Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms (Konrad
Dybcio)
- Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki)
- Add DT bindings for QCom ipq9574 (Praveenkumar I)
- Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren)
- Allow selecting the bang-bang governor as default (Thierry Reding)
- Refactor and prepare the code to set the scene for RCar Gen4
(Wolfram Sang)
- Cleanup and fixes for the QCom tsens drivers. Add DT bindings and
calibration for the MSM8909 platform (Stephan Gerhold)
- Revert a patch introducing a wrong usage of devm_of_iomap() on the
Mediatek platform (Ricardo Cañuelo)
- Fix the clock vs reset ordering in order to conform to the
documentation on the sun8i (Christophe JAILLET)
- Prevent setting up undocumented registers, enable the only described
sensors and add the version 2.1 on the Qoriq sensor (Peng Fan)
- Add DT bindings and support for the Armada AP807 (Alex Leibovich)
- Update the mlx5 driver with the recent thermal changes (Daniel
Lezcano)
- Convert to platform remove callback returning void on STM32 (Uwe
Kleine-König)
- Add an error information printing for devm_thermal_add_hwmon_sysfs()
and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra,
Qoriq, Mediateka and QCom (Yangtao Li)
- Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai)
- Use the dev_err_probe() function in the QCom tsens alarm driver
(Luca Weiss)"
* tag 'thermal-v6.5-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (38 commits)
thermal/drivers/qcom/temp-alarm: Use dev_err_probe
thermal/drivers/generic-adc: Register thermal zones as hwmon sensors
thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start()
thermal/drivers/qcom: Remove redundant msg at probe time
thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor()
thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone()
thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel()
drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe()
thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe()
thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe()
thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register()
thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs()
thermal/drivers/stm32: Convert to platform remove callback returning void
net/mlx5: Update the driver with the recent thermal changes
thermal/drivers/armada: Add support for AP807 thermal data
dt-bindings: armada-thermal: Add armada-ap807-thermal compatible
thermal/drivers/qoriq: Support version 2.1
thermal/drivers/qoriq: Only enable supported sensors
thermal/drivers/qoriq: No need to program site adjustment register
thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensors
...
|
|
|
|
Merge power capping updates for 6.5-rc1:
- Introduce power capping core support for Intel TPMI (Topology Aware
Register and PM Capsule Interface) and a TPMI interface driver for
Intel RAPL (Zhang Rui, Dan Carpenter).
- Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping
driver (Zhang Rui).
- Fix invalid initialization for pl4_supported field in the Intel RAPL
power capping driver (Sumeet Pawnikar).
* powercap:
powercap: RAPL: Fix a NULL vs IS_ERR() bug
powercap: RAPL: Fix CONFIG_IOSF_MBI dependency
powercap: RAPL: fix invalid initialization for pl4_supported field
powercap: intel_rapl: Introduce RAPL TPMI interface driver
powercap: intel_rapl: Introduce core support for TPMI interface
powercap: intel_rapl: Introduce RAPL I/F type
powercap: intel_rapl: Make cpu optional for rapl_package
powercap: intel_rapl: Remove redundant cpu parameter
powercap: intel_rapl: Add support for lock bit per Power Limit
powercap: intel_rapl: Cleanup Power Limits support
powercap: intel_rapl: Use bitmap for Power Limits
powercap: intel_rapl: Change primitive order
powercap: intel_rapl: Use index to initialize primitive information
powercap: intel_rapl: Support per domain energy/power/time unit
powercap: intel_rapl: Support per Interface primitive information
powercap: intel_rapl: Support per Interface rapl_defaults
powercap: intel_rapl: Allow probing without CPUID match
powercap: intel_rapl: Remove unused field in struct rapl_if_priv
|
|
Use the dev_err_probe function instead of dev_err in the probe function
so that the printed message includes the return value and also handles
-EPROBE_DEFER nicely.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz
|
|
Register thermal zones as hwmon sensors to let userspace read
temperatures using standard hwmon interface.
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
[Yangtao: only keep devm_thermal_add_hwmon_sysfs]
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-11-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-10-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-8-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-7-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-6-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-5-frank.li@vivo.com
|
|
imx_sc_thermal_probe()
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-3-frank.li@vivo.com
|
|
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-2-frank.li@vivo.com
|
|
Ensure that all error handling branches print error information. In this
way, when this function fails, the upper-layer functions can directly
return an error code without missing debugging information. Otherwise,
the error message will be printed redundantly or missing.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-1-frank.li@vivo.com
|
|
The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is (mostly) ignored
and this typically results in resource leaks. To improve here there is a
quest to make the remove callback return void. In the first step of this
quest all drivers are converted to .remove_new() which already returns
void.
st_thermal_unregister() always returned zero, so convert it to return void
without any loss and then just drop the return from st_mmap_remove().
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230616165641.1055854-1-u.kleine-koenig@pengutronix.de
|
|
Add support for the AP807 die thermal data. This is the same as AP806,
except for the coefficients.
ap807 values taken from TSENSE_ADC_16FFC spec, which says:
T(in Celsius) = T(code)*TSENE_GAIN+TSENE_OFFSET
where in default:
TSENE_OFFSET = 128.9
TSENE_GAIN = 0.394
Signed-off-by: Alex Leibovich <alexl@marvell.com>
Tested-by: sa_ip-sw-jenkins <sa_ip-sw-jenkins@marvell.com>
Reviewed-by: Stefan Chulski <stefanc@marvell.com>
Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/E1qA7yU-00Ea4u-Je@rmk-PC.armlinux.org.uk
|
|
i.MX93 use TMU version 2.1, which supports:
- TRITSR_TP5(When this field is 1, you must add 0.5 K to the temperature
that TEMP reports. For example, if TEMP is 300 K and TP5=1, then the
final temperature is 300.5 K.)
- Has 16 TTRCR register: Temperature Range Control (TTRCR0 - TTRCR15)
This patch is to add this support.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-4-peng.fan@oss.nxp.com
|
|
There are MAX 16 sensors, but not all of them supported. Such as
i.MX8MQ, there are only 3 sensors. Enabling all 16 sensors will
touch reserved bits from i.MX8MQ reference mannual, and TMU will stuck,
temperature will not update anymore.
Fixes: 45038e03d633 ("thermal: qoriq: Enable all sensors before registering them")
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-3-peng.fan@oss.nxp.com
|
|
No need to program site adjustment register, as programming
these registers do not give accurate value and also these
registers are not mentioned in Reference Manual.
Signed-off-by: Pankit Garg <pankit.garg@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516083746.63436-2-peng.fan@oss.nxp.com
|
|
Register thermal zones as hwmon sensors to let userspace read
temperatures using standard hwmon interface.
Signed-off-by: Chen-Yu Tsai <wenst@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230613091317.1691247-1-wenst@chromium.org
|
|
Should an error occur after calling sun8i_ths_resource_init() in the probe
function, some resources need to be released, as already done in the
.remove() function.
Switch to the devm_clk_get_enabled() helper and add a new devm_action to
turn sun8i_ths_resource_init() into a fully managed function.
Move the place where reset_control_deassert() is called so that the
recommended order of reset release/clock enable steps is kept.
A64 manual states that:
3.3.6.4. Gating and reset
Make sure that the reset signal has been released before the release of
module clock gating;
This fixes the issue and removes some LoC at the same time.
Fixes: dccc5c3b6f30 ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40")
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Acked-by: Maxime Ripard <maxime@cerno.tech>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a8ae84bd2dc4b55fe428f8e20f31438bf8bb6762.1684089931.git.christophe.jaillet@wanadoo.fr
|
|
in mtk_thermal_probe"
This reverts commit f05c7b7d9ea9477fcc388476c6f4ade8c66d2d26.
That change was causing a regression in the generic-adc-thermal-probed
bootrr test as reported in the kernelci-results list [1].
A proper rework will take longer, so revert it for now.
[1] https://groups.io/g/kernelci-results/message/42660
Fixes: f05c7b7d9ea9 ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe")
Signed-off-by: Ricardo Cañuelo <ricardo.canuelo@collabora.com>
Suggested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230525121811.3360268-1-ricardo.canuelo@collabora.com
|
|
The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like
MDM9607 it uses a non-standard default slope value of 3000 [1] and needs
per-sensor "correction factors" to workaround issues with the factory
calibration [2].
[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476
[2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-6-5eb632235ba7@kernkonzept.com
|
|
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].
The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].
Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
- TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET
- TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.
[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e
[2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136
Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
|
|
According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses
a non-standard slope value of 3000 (instead of 3200) for all sensors.
Fill it properly similar to the 8939 code added recently.
[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875
Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-2-5eb632235ba7@kernkonzept.com
|
|
The old single-cell parsing code was removed for MSM8939, MDM9607 and
MSM8976 but for some reason the structs defining the bit positions etc
were kept around (unused). Drop them now.
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Fixes: 51d78b8b1beb ("thermal/drivers/tsens: Drop single-cell code for mdm9607")
Fixes: dfadb4599ab0 ("thermal/drivers/tsens: Drop single-cell code for msm8939")
Fixes: 3a908971f7cb ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
|
|
For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.
The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.
Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
|
|
The registers are differently named and at different offsets, but their
functionality is the same as for Gen3.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
|
|
function
Gen4 will be very different, so refactor Gen3 access into separate call
first.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
|
|
More items to describe the TSCs are needed soon, so encapsulate the
current 'ths_tj_1' item into a struct.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
|
|
Since commit 955fb8719efb ("thermal/intel/intel_soc_dts_iosf: Use Intel
TCC library") intel_soc_dts_iosf is reporting the wrong temperature.
The driver expects tj_max to be in milli-degrees-celcius but after
the switch to the TCC library this is now in degrees celcius so
instead of e.g. 90000 it is set to 90 causing a temperature 45
degrees below tj_max to be reported as -44910 milli-degrees
instead of as 45000 milli-degrees.
Fix this by adding back the lost factor of 1000.
Fixes: 955fb8719efb ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library")
Reported-by: Bernhard Krug <b.krug@elektronenpumpe.de>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Export Passive version 2 table similar to the way _TRT and _ART tables
via IOCTLs.
This removes need for binary utility to read ACPI Passive 2 table by
providing open source support. This table already has open source
implementation in the user space thermald, when the table is part of
data vault exported by the int3400 sysfs.
This table is supported in some older platforms before Ice Lake
generation.
Passive 2 tables contain multiple entries. Each entry has following
fields:
* Source: Named Reference (String). This is the source device for
temperature.
* Target: Named Reference (String). This is the target device to
control.
* Priority: Priority of this device compared to others.
* SamplingPeriod: Time Period in 1/10 of seconds unit.
* PassiveTemp: Passive Temperature in 1/10 of Kelvin.
* SourceDomain: Domain for the source (00:Processor, others reserved).
* ControlKnob: Type of control knob (00:Power Limit 1, others: reserved)
* Limit: The target state to set on reaching passive temperature.
This can be a string "max", "min" or a power limit value.
* LimitStepSize: Step size during activation.
* UnLimitStepSize: Step size during deactivation.
* Reserved1: Reserved
Three IOCTLs are added similar to IOCTLs for reading TRT:
ACPI_THERMAL_GET_PSVT_COUNT: Number of passive 2 entries.
ACPI_THERMAL_GET_PSVT_LEN: Total return data size (count x each
passive 2 entry size).
ACPI_THERMAL_GET_PSVT: Get the data as an array of objects with
passive 2 entries.
This change is based on original development done by:
Todd Brandt <todd.e.brandt@linux.intel.com>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog and subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Prior to the commit "763bd29fd3d1 ("thermal: int340x_thermal: Use
sysfs_emit_at() instead of scnprintf()", there was a new line after each
UUID string.
With the newline removed, existing user space like "thermald" fails to
compare each supported UUID as it is using getline() to read UUID and
apply correct thermal table.
To avoid breaking existing user space, add newline after each UUID string.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 763bd29fd3d1 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()")
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Different RAPL Interfaces may have different primitive information and
rapl_defaults calls.
To better distinguish this difference in the RAPL framework code,
introduce a new enum to represent different types of RAPL Interfaces.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
MSR RAPL Interface always removes a rapl_package when all the CPUs in
that rapl_package are offlined. This is because it relies on an online
CPU to access the MSR.
But for RAPL Interface using MMIO registers, when all the cpus within
the rapl_package are offlined,
1. the register can still be accessed
2. monitoring and setting the Power Pimits for the rapl_package is still
meaningful because of uncore power.
This means that, a valid rapl_package doesn't rely on one or more cpus
being onlined.
For this sense, make cpu optional for rapl_package. A rapl_package can
be registered either using a CPU id to represent the physical
package/die, or using the physical package id directly.
Note that, the thermal throttling interrupt is not disabled via
MSR_IA32_PACKAGE_THERM_INTERRUPT for such rapl_package at the moment.
If it is still needed in the future, this can be achieved by selecting
an onlined CPU using the physical package id.
Note that, processor_thermal_rapl, the current MMIO RAPL Interface
driver, can also be converted to register using a package id instead.
But this is not done right now because processor_thermal_rapl driver
works on single-package systems only, and offlining the only package
will not happen. So keep the previous logic.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Currently, a RAPL package is registered with the number of Power Limits
supported in each RAPL domain. But this doesn't tell which Power Limits
are available. Using the number of Power Limits supported to guess the
availability of each Power Limit is fragile.
Use bitmap to represent the availability of each Power Limit.
Note that PL1 is mandatory thus it does not need to be set explicitly by
the RAPL Interface drivers.
No functional change intended.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Wang Wendy <wendy.wang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
If cur_state for the powerclamp cooling device is set to the default
minimum state of 0, without setting first to cur_state > 0, this results
in NULL pointer access.
This NULL pointer access happens in the powercap core idle-inject
function idle_inject_set_duration() as there is no NULL check for
idle_inject_device pointer. This pointer must be allocated by calling
idle_inject_register() or idle_inject_register_full().
In the function powerclamp_set_cur_state(), idle_inject_device pointer
is allocated only when the cur_state > 0. But setting 0 without changing
to any other state, idle_inject_set_duration() will be called with a
NULL idle_inject_device pointer.
To address this, just return from powerclamp_set_cur_state() if the
current cooling device state is the same as the last one. Since the
power-up default cooling device state is 0, changing the state to 0
again here will return without calling idle_inject_set_duration().
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 8526eb7fc75a ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Bugzilla: https://bugzilla.kernel.org/show_bug.cgi?id=217386
Tested-by: Risto A. Paju <teknohog@iki.fi>
Cc: 6.3+ <stable@kernel.org> # 6.3+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
|
|
Merge additional thermal core and ACPI thermal changes for 6.4-rc1:
- Clean up the step-wise thermal governor (Zhang Rui).
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano).
- Clean up the ACPI thermal driver a bit (Daniel Lezcano).
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki).
* thermal-core:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
|
|
According to my information, there are no active users of this driver in
the field.
Moreover, it does some really questionable things and gets in the way of
thermal core improvements, so drop it.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The pch_critical() callback accesses the thermal zone device structure
internals, it dereferences the thermal zone struct device and the 'type'.
Use the available accessors instead of accessing the structure directly.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.
Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.
By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
For the algorithm of choosing the next target state in step_wise
governor, the code does the right thing but is implemented in a
way different from what the comment describes. And this hurts the code
readability.
As the logic in the comment is simpler, adjust the code logic to align
with the comment.
No functional change.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject edit ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Commit 4102c4042a33 ("thermal/core: Remove DROP_FULL and RAISE_FULL")
removes support for THERMAL_TREND_RAISE_FULL/DROP_FULL but leaves the
comment unchanged.
Delete the obsolte comment about THERMAL_TREND_RAISE_FULL/DROP_FULL.
Fixes: 4102c4042a33 ("thermal/core: Remove DROP_FULL and RAISE_FULL")
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
